C.C. Wei

Wei earned a PhD in electrical engineering from Yale and spent decades in semiconductor manufacturing before rising through TSMC's ranks. He became CEO in 2018 and later chairman, succeeding the company's founder Morris Chang and its interim leadership.

Under Wei, TSMC extended its lead in advanced process technology and advanced packaging (CoWoS), the very capabilities that gate AI accelerator production. When AI chips are described as "sold out," the constraint is often TSMC's manufacturing and packaging capacity that Wei oversees.

He has steered TSMC's global expansion — new fabs in Arizona, Japan, and Germany — in response to customer demand and geopolitical pressure to diversify beyond Taiwan, while keeping the most advanced nodes anchored at home. His decisions shape the physical supply of the entire AI hardware industry.